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X1000
Chip Block Diagram Chip Specifications Data Download Applications Development Platform
X1000
低功耗物联网处理器
  • 高性能XBurst® 1 CPU，主频1.0GHz
  • 超低功耗(<200mW)
  • 1秒极速启动
  • 内置LPDDR（X1000：32MB，X1000E：64MB）
  • 内置语音唤醒引擎和音频CODEC
    • Sample Application
    Chip Block Diagram
    Chip Specifications
    CPU
    XBurst®1CPU 1.0GHz，MIPS架构
    硬件FPU，SIMD
    16KB L1 I-cache和16KB L1 D-cache，128KB L2统一cache
    内存
    片内32/64MBytes LPDDR
    显示屏支持
    支持8-bit、9-bit、16-bit并行接口SLCD
    摄像头支持
    支持8-bit并行接口，支持200万像素设备
    JPEG硬件编码器，1280x720@30fps
    支持CCIR656输入
    音频处理器及接口
    嵌入式高品质音频编解码器，含立体声ADC和DAC
    低功耗DMIC控制器，含语音唤醒引擎
    支持I2S/ SPDIF接口的外部音频编解码器
    有主/从模式的PCM接口
    片上接口
    I2C x3
    SPI x1
    USB 2.0HS OTG x1
    MMC/SD/SDIO x2
    全双工UARTx3
    串口flash接口x1
    智能卡接口x1
    I2S x1
    PCM x1
    以太网MAC x1
    安全性
    1Kbits OTP ROM
    支持RSA(1024bits)和AES(128bits)硬件编码
    支持安全启动
    封装
    封装形式BGA-190，外形尺寸13mm x 13mm x 1.2mm，0.8mm Pitch
    Data Download
    X1000/X1000E产品简介
    Download
    X1000/X1000E数据手册
    Download
    SIMD_MXU用户手册
    Download
    T41 INDUS 开发套板
    芯片：T41LQ
    芯片：T41LQ
    Development Board Application Form
    Proxy Company Information
    Customer Company Information
    Specific Model for Development Board Application