lngenic 君正

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On October 27, Ingenic Tech Wave 2025 was grandly held at The Ritz-Carlton, Shenzhen. This summit focused on technological breakthroughs and future layouts, sharing Ingenic's macro plans, technological development, product portfolio, and ecosystem layout in the computing chip field with the industry through multiple keynote speeches. Over 800 people gathered here to jointly witness the robust R&D strength of Ingenic's chips and its firm steps in continuously empowering diverse fields such as AIoT, intelligent vision, smart home, and industrial control.

‌Strategic Focus: Comprehensive AI Layout Empowering All Industries

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Currently, AI technology is accelerating its empowerment of the chip industry by optimizing chip architecture, accelerating computing power demands, and promoting specialized design, becoming a key technological breakthrough for chip manufacturers.

At the beginning of the summit, John, Chairman of Ingenic, reviewed the company's 20-year development journey, dividing it into three significant phases. Starting from the CPU technology breakthrough in 2005, to the comprehensive layout of computing and AI technologies beginning in 2013, and then to the acquisition of ISSI in 2020 to layout memory and analog product lines, successfully establishing a new development pattern of "Computing + Storage + Analog," laying a solid foundation for subsequent technological innovation and industrial expansion.

After years of deep cultivation, Ingenic has built a core technology system covering CPU, AI, audio and video, imaging, AOV low power consumption, and other fields. It possesses CPU cores such as the Victory (RISC-V) and XBurst (MIPS) series, advanced AI processing units like NPU 3.0 and NPU 4.0, and codec processing technologies including H.264 and H.265. It has also established a complete technical support system including the Magik AI development platform. These technologies synergize with each other, forming a powerful technical force that empowers various intelligent terminal products.

Facing the future, John proposed the company's "Third Entrepreneurship" AI development path, clarifying a strategy centered on AI, covering computing, storage, perception, and execution as the four key dimensions.

John, Chairman of Ingenic

In the computing field, based on the RISC-V architecture, the focus is on AI-Vision, LLM, AI-MCU/AI-MPU, continuously iterating CPU and NPU technologies. From NPU 1.0 to the upcoming NPU 4.0, computing power spans from 0.1 TOPS to 512 TOPS, meeting diverse needs from the edge to edge computing. Simultaneously, leveraging the RISC-V architecture enables full platform coverage and continuous breakthroughs in microarchitecture efficiency.

In the storage field, there is a continuous enhancement of R&D, manufacturing, and product capabilities, actively laying out emerging directions like 3D-DRAM. Through hybrid bonding, capabilities such as high bandwidth, low power consumption, and edge AI are added to meet the high demands for memory bandwidth in the AIoT era.

In the perception field, deep cultivation in Audio/Video processing, AI perception algorithms, and multimodal technologies continues. ISP imaging technology is upgraded, audio recognition and enhancement solutions are optimized, audio and video compression technologies are innovated, and application scenarios for algorithms like object recognition and multimodal recognition are expanded.

In the execution field, the focus is on three major sectors: motor control, printing technology, and interactive experience, covering various motor types, printing methods, and interaction forms like screen display and voice, providing "all-in-one" solutions to comprehensively empower the intelligent upgrade of terminal equipment.

To this end, John emphasized that over the past twenty years, Ingenic has deeply cultivated the industry, accumulating its differentiated advantages. In the future, it will continue to layout AI technology, empower the industry through continuous technological innovation and ecosystem building, and contribute core strength to the development of the global AIoT industry.

‌Full-Scale Attack: New Product Releases Fully Embrace the New AOV Competitive Landscape

"AOV has become the first proprietary term that Ingenic has truly contributed to this industry since entering the intelligent vision market," said Brad, Deputy General Manager of the Intelligent Vision Business Unit. He also shared Ingenic's future technological innovations with the concepts of "Targeted Approach" and "Integrated Delivery."

Brad, Deputy General Manager of the Intelligent Vision Business Division

From the T31 based on Linux, to the dual-camera T40, to the pioneering AOV mode T41, and the heavyweight releases at this summit including the T33, T32P, and other new products, Ingenic has fully demonstrated its product strength in the AOV technology field.

According to Zoro, Senior Director of the Intelligent Vision Business Unit, the T33, as an "entry-level flagship" product, focuses on 5M resolution, multi-camera capabilities, AI capabilities, lower power consumption, and fully compatible design. The T32P complements the T33, supporting comprehensive 4K solutions, with AI capability reaching 1 TOPS, featuring functions like Linux fast boot + AOV + pre-roll, providing support for panoramic innovation and cross-border sports applications.

‌Zoro, Senior Director of the Intelligent Vision Business Division

Notably, the T33 chip has already entered mass production and large-scale application. It will be jointly launched with partners like Qiaoan, Weipai, Qingshi, and Mirui to collectively create exponential prosperity in the intelligent vision market.

Beyond the T33, Zoro introduced that the T3x series will support multi-camera synchronization and AOV-AT mode, targeting SMB scenarios, balancing the battery life and image quality requirements of battery-powered devices, covering monitoring needs at longer distances. Furthermore, the AOV-U and AOV-x series further expand the boundaries of ultra-low power consumption and multimodal perception, targeting the home consumer market to achieve extreme power consumption. Combined with technologies like Pre-Roll pre-recording, Mert AI audio enhancement, and super encoding, they provide more competitive solutions for scenarios such as smart door locks, home security, and outdoor cameras.

In the future, Brad emphasized that Ingenic will pursue R&D in two directions: the T42 chip for steady-state imaging and the Corot 3.0 series for dynamic imaging. Particularly, the T42 will directly address the challenges of low-light vision, strengthening the company's core competitiveness in the consumer security field with higher requirements, greater computing power, and lower power consumption.

In the field of large models, Brad first proposed the concept of "Edge-side Visual Agent," to be achieved by developing the two technical base points of "Object Recognition" and "Video Understanding." Based on the visual agent, there is potential to build a home video intelligence center in the future.

‌Advancing Together: Multiple Product Lines Continuously Iterate to Facilitate Scenario Application Landing‌

Based on the comprehensive upgrade of CPU microarchitecture, various NPU 3.0 solutions meeting the high computing power demands of edge scenarios, H.264 and H.265 codec processing technologies, and the complete technical support system including the Magik AI platform will help Ingenic achieve accelerated growth in chip iteration speed.

In the MCU field, to address the various pain points of traditional MCUs in terms of computing power, memory and storage resources, and adaptability to edge intelligence scenarios, Ingenic is breaking into the high-performance market with the new AI-MCU product G32S10M, building a new edge ecosystem. This chip integrates a RISC-V dual-core, self-developed NPU (0.5 TOPS), and large-capacity PSRAM, supporting image recognition, voice interaction, and intelligent motor control. It significantly enhances AI computing power while maintaining the real-time performance of MCUs, truly achieving the integration of "Control + Intelligence." It can be widely used in smart home appliances, industrial control, robotics, energy storage, and other fields.

Toney, General Manager of Shenzhen Ingenic and Senior Director of MCU, also pointed out that for the entire MCU ecosystem, Ingenic will cooperate with sensor, BT/Wi-Fi, CAT1, memory manufacturers, and others to jointly develop, providing integrated "AI-MCU + Sensor" modules to reduce the selection difficulty for end customers and empower applications in smart mobility, smart office, smart industry, and other fields, jointly embracing the development opportunities of AI-MCU.

Toney, General Manager of Shenzhen Ingenic and Senior Director of MCU

In the ISP field, as the new consumer brand with the most imaginative space in recent years, AI glasses are rapidly emerging as the next-generation mobile computing platform. Neil, Product Line Director of Pan-Video, Intelligent Vision Business Unit, believes that the core value of AI glasses is "rapid first-person perspective recording under multimodal interaction." With TWS/OWS technology fully mature, the breakthrough in ISP power consumption is the key to solving the "impossible triangle" problem in smart wearable devices.

At this summit, Ingenic released the new CW series ISP chips, achieving higher image quality, lower power consumption, and smaller size, covering the full range of applications for AI glasses, AI photo-taking earphones, photo-taking smartwatches, and environmental perception wearable products. The CW080, scheduled for release in Q1 2026, features 12MP ultra-high-definition photo capability, supports edge-level EIS anti-shake, and supports an ultra-fast response capability to complete photo capture within 200ms. The CW020, scheduled for Q2 2026, and the CW240, scheduled for Q4 2026, with their ultra-small package, ultra-low power consumption, higher resolution, and other performance innovations, bring more powerful ISP solutions to the smart wearable device market.

Neil, Director of Product Line, Pan-Video Division, Intelligent Vision Business Unit

In the MPU field, from the X1600 to the X3000, Ingenic's MPU products have continuously evolved, with overall performance Comprehensive improvement, further improving overall system reliability while maintaining lower power consumption. They have been deeply applied in smart retail fields like QR code scanning devices and POS machines, as well as smart life fields like printers,Robotic vacuum cleaner, and home/appliance display control products. This summit also highlighted the dedicated chip for the LED display industry, the D200. It integrates an LED controller, supports H.264 decoding, supports 4-layer overlay, and includes a hardware rotation module. It offers four core advantages for the LED industry: first, direct drive; second, transmission of compressed streams, requiring low bandwidth; third, hardware decoding and synchronization; fourth, intelligence. Through software definition, it aims to grant new momentum to the LED industry.

Sam, Market Development Director of the MPU Business Unit, emphasized that the future plan for Ingenic's MPU product line will continue to strengthen the multi-core heterogeneous route, focusing on expanding AI edge intelligent computing, and further expanding the boundaries of AIoT application scenarios through software-hardware cooperate with optimization.

Sam, Director of Market Expansion, MPU Business Unit

‌Innovative Linkage: Three Major Theme Exhibition Areas Showcasing the Full Ecosystem Comprehensively

This time, Ingenic not only brought the Tech Wave 2025 summit but also held an Innovation Application Exhibition from October 28th to 30th on the 6th floor of The Ritz-Carlton, Shenzhen, featuring three major theme exhibition areas: Smart Retail, Video Conferencing & Pan-Vision, and Visual Video Security. Among them, the Smart Retail exhibition area covered smart retail solutions, AI-MCU, smart life solutions, and MPU chips. The Video Conferencing & Pan-Vision exhibition area covered smart wearable ISPs, intelligent care and hunting cameras, and smart lock solutions. The Visual Video Security exhibition area covered technologies and exhibits like AI encoding, AI-NVR, multi-camera solutions, high-frame-rate solutions, Gekko2.0, AOV-Series, T33 new product, and T-Series Roadmap, covering high-cost-performance solutions for various scenario applications.

Ingenic Tech Wave 2025 is not only a technological feast but also an important exchange and display platform for the intelligent chip industry. With the continuous integration of technologies like AI, RISC-V, and large models, Ingenic is accelerating the empowerment of Chinese intelligent hardware in the global AIoT market with its full-stack chip solutions.